A memory module, also known as a RAM (random access memory) stick, is a printed circuit board on which memory integrated circuits are mounted. Memory modules provide simple installation and replacement in electronic systems, especially personal computers, workstations, servers, and other types of computers. The first memory modules were proprietary designs that were specific to a model of computer from a specific manufacturer, but later modules would be standardized by organizations such as JEDEC, a semiconductor engineering trade organization and standardization body, to be compatible with any system designed to use memory modules.
There are three main types of memory modules:
1.Trans Flash Memory Modules are functionally identical to MicroSD cards, meaning both are able to operate in any device made for one or the other. They are primarily used in mobile phones.
2.SIMM is a type of memory module that contains random access memory. SIMMs were used in computers from the early 1980s to 1990s and have largely been replaced by DIMM.
3.DIMM is the most common type of memory module. These comprise a series of dynamic random access memory (DRAM) integrated circuits. DIMM modules are mounted on a printed circuit board and designed for use in personal computers, workstations, printers, and servers. DIMMs began to replace SIMMs as the predominant memory module type in the 1990s as Intel P5-based Pentium processors began to increase in popularity.
There are two subtypes of DIMM: Rambus and SO-DIMM.
The primary characteristics used to distinguish computer memory modules are voltage, capacity, speed (bit rate) and form factor. The large main memories used in personal computers system, workstations, and non-handheld game consoles such as PlayStation and XBOX normally consist of DRAM. Other parts of the computer, such as cache memory, typically use SRAM (static RAM). In some cases, small amounts of SRAM are used in the same packages as DRAM. However, because SRAM has high leakage power and low density, die-stacked (stacked and vertically interconnected) DRAM is becoming more commonly used for designing multi-megabyte sized processor caches. Physically, most memory modules are packaged in black epoxy resin.
DRAM memory modules are produced as integrated circuits bonded and mounted into plastic packages with metal pins for connection to control signals and buses. In its early days, DRAM integrated circuits were either installed directly to the motherboard or on ISA (industry standard architecture) expansion cards. They have since been assembled into multi-chip plug in modules. Standard DRAM module types include DRAM chip, DRAM modules, stacked RAM modules, and unstacked RAM modules.
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